In a press launch selling the Strategic Materials Summit scheduled to be held in September through the week of SEMICON Taiwan 2022, Terry Tsao, President of SEMI Taiwan and the affiliation’s world chief advertising officer, cited a SEMI report indicating that the general semiconductor materials market dimension is prone to develop 8.6% in 2022 and attain US$69.8 billion, a brand new document excessive.
The wafer materials market alone will develop 11.5% to US$45.1 billion, whereas the packaging materials market will enhance by 3.9%, to US$24.8 billion, respectively. The semiconductor materials market worth is predicted to exceed US$70 billion in 2023.
The size of SEMICON Taiwan 2022 reached a 10-year excessive, in response to the real-time information on SEMI Taiwan’s official web site. It’s anticipating to obtain greater than 50,000 guests this 12 months, with 700 exhibitors to showcase their services and products in 2,450 cubicles. Exhibitor quantity and sales space scales elevated by 30% and 60% respectively, from 2021, because the world step by step reopens to cross-border journey within the post-pandemic period.
In the course of the four-day occasion (Sept 13-16), the subjects to be coated in symposiums and workshops embrace superior manufacturing, heterogeneous integration, compound semiconductor, auto chips, good manufacturing, sustainability, semiconductor cybersecurity, and workforce.
Featured audio system collaborating within the SEMICON Taiwan 2022 embrace Bob Chen, Normal Supervisor of Foxconn Semiconductor Enterprise Group; Hans Adlkofer, SVP of Infineon’s Automotive Division; Yoshifumi Kato, CTO of Denso; Takeshi Kataoka, SVP and Normal Supervisor of Automotive Answer Enterprise Unit at Renesas; Kai Beckmann, CEO of Merck; Raymond Pao, SVP of Enterprise Options at HTC; Berthold Hellenthal, Strategic Semiconductor Administration at Volkswagen, and many others.
In response to occasion highlights, TSMC, Intel, ASE, AMD, AUO and different trade leaders will talk about the most recent advances in 2.5D/3D IC packaging options and superior testing applied sciences on the Heterogeneous Integration World Summit 2022, IC Discussion board, and Superior Testing Discussion board.
Audi, Denso, Bosch, PixArt, Foxconn, Win Semiconductor and Qorvo will share modern automotive applied sciences and assist strengthen the community of design and manufacturing companions on the World Auto Chips Govt Summit, MEMS & Sensors Discussion board, and Energy and Opto Semiconductor Discussion board.
